Fully-Depleted Soi CMOS Circuits and Technology for Ultralow-Power Applications
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Fully-Depleted Soi CMOS Circuits and Technology for Ultralow-Power Applications

Fully-Depleted Soi CMOS Circuits and Technology for Ultralow-Power Applications


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About the Book

Fully-depleted SOI CMOS Circuits and Technology for Ultralow-Power Applications addresses the problem of reducing the supply voltage of conventional circuits for ultralow-power operation and explains power-efficient MTCMOS circuit design for FD-SOI devices at a supply voltage of 0.5 V. The topics include the minimum required knowledge of the fabrication of SOI substrates; FD-SOI devices and the latest developments in device and process technologies; and ultralow-voltage circuits, such as digital circuits, analog/RF circuits, and DC-DC converters. Each ultra-low-power technique related to devices and circuits is fully explained using figures to help understanding.
About the Author:

Takayasu Sakurai received the Ph.D degree in Electronic Engineering from University of Tokyo, Japan, in 1981 and he joined Toshiba Corporation, where he designed CMOS DRAM, SRAM, BiCMOS ASIC's, RISC's, and multimedia VLSI's. He worked on simple yet accurate interconnect delay, capacitance and MOS models widely used as alpha power-law MOS model. He proposed to sense-amplifying flip-flops, variable threshold voltage CMOS scheme, dual voltage converter scheme, hot carrier resilient circuits and other numerous digital and memory circuits, which are adopted in current high-performance, low-power VLSI's. He was a visiting researcher at University of California, Berkeley from 1988 to 1990. In 1996, he moved to University of Tokyo and is consulting to US startup companies. He has published about 250 technical publications including more than 30 invited papers and 6 books and filed about 100 patents. He is a recipient of four product awards and two design contest awards. He served as a conference chair for the Symposium on VLSI Circuits, and a technical program committee member for ISSCC, CICC, DAC, ICCAD, FPGA workshop, ISLPED, ASPDAC, TAU, and other international conferences. He is a keynote speaker for the 2003 ISSCC. He is an IEEE Fellow, an elected Administration Committee member for the IEEE Solid-State Circuits Society and an IEEE CAS distinguished lecturer.


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Product Details
  • ISBN-13: 9780387292175
  • Publisher: Springer
  • Publisher Imprint: Springer
  • Edition: 2006 ed.
  • Language: English
  • Returnable: Y
  • Spine Width: 23 mm
  • Width: 163 mm
  • ISBN-10: 0387292179
  • Publisher Date: 01 Apr 2006
  • Binding: Hardback
  • Height: 247 mm
  • No of Pages: 411
  • Series Title: English
  • Weight: 825 gr


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