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Flat 10% Off Upto 10AED - Use Code FLAT10

Purchase Any Book And Get 5AED Off - Use Code FIRST

Flat 10% Off Upto 10AED - Use Code FLAT10

Purchase Any Book And Get 5AED Off - Use Code FIRST

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1.
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
By: Y.C. Lee, C.P. Wong, Ephraim Suhir, C.P. Wong (Editor), Ephraim Suhir (Editor)
Publisher: Springer
No Review Yet
AED3,488
Binding:
Paperback
Release:
23 Aug 2016
Language:
English
Out of Stock
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2.
Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
By: Yi-Shao Lai, C.P. Wong, Ho-Ming Tong (Editor), Yi-Shao Lai (Editor)‎, C.P. Wong (Editor)
Publisher: Springer
No Review Yet
AED1,064
Binding:
Paperback
Release:
23 Aug 2016
Language:
English
Out of Stock
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