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1.
Fundamentals of Lead-Free Solder Interconnect Technology
Fundamentals of Lead-Free Solder Interconnect Technology
By: Tae-Kyu Lee, Choong-Un Kim, Thomas R. Bieler , Hongtao Ma, Thomas R Bieler
Publisher: Springer
No Review Yet
AED1,132
Binding:
Hardback
Release:
01 Dec 2014
Language:
English
International Edition
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2.
Electromigration in Thin Films and Electronic Devices
Electromigration in Thin Films and Electronic Devices
By: C. U. Kim, Choong-Un (EDT) Kim, C-U Kim
Publisher: Elsevier Science & Technology
No Review Yet
AED1,911
Binding:
Hardcover
Release:
28 Aug 2011
Language:
English
Out of Stock
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3.
Fundamentals of Lead-Free Solder Interconnect Technology
Fundamentals of Lead-Free Solder Interconnect Technology
By: Tae-Kyu Lee, Choong-Un Kim, Thomas R. Bieler , Hongtao Ma, Thomas R Bieler
Publisher: Springer
No Review Yet
AED726
Binding:
Paperback
Release:
01 Oct 2016
Language:
English
Out of Stock
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