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1.
Electromigration in Thin Films and Electronic Devices
Electromigration in Thin Films and Electronic Devices
By: C-U Kim, Choong-Un Kim, Choong-Un (University of Texas at Arlington, USA) Kim
Publisher: Woodhead Publishing
No Review Yet
AED2,378
Binding:
Paperback
Release:
19 Aug 2016
Language:
English
International Edition
Ships within 22-24 Days Explain..
Free Shipping in UAE.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
2.
Fundamentals of Lead-Free Solder Interconnect Technology
Fundamentals of Lead-Free Solder Interconnect Technology
By: Tae-Kyu Lee, Choong-Un Kim, Thomas R. Bieler , Hongtao Ma, Thomas R Bieler
Publisher: Springer
No Review Yet
AED1,076
Binding:
Hardback
Release:
01 Dec 2014
Language:
English
International Edition
Ships within 22-24 Days Explain..
Free Shipping in UAE.
3.
Electromigration in Thin Films and Electronic Devices
Electromigration in Thin Films and Electronic Devices
By: C. U. Kim, Choong-Un (EDT) Kim, C-U Kim
Publisher: Elsevier Science & Technology
No Review Yet
AED1,911
Binding:
Hardcover
Release:
28 Aug 2011
Language:
English
Out of Stock
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4.
Fundamentals of Lead-Free Solder Interconnect Technology
Fundamentals of Lead-Free Solder Interconnect Technology
By: Tae-Kyu Lee, Choong-Un Kim, Thomas R. Bieler , Hongtao Ma, Thomas R Bieler
Publisher: Springer
No Review Yet
AED726
Binding:
Paperback
Release:
01 Oct 2016
Language:
English
Out of Stock
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