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Chuan Seng Tan

Chuan Seng Tan

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1.
Advances in 3D Integrated Circuits and Systems
Advances in 3D Integrated Circuits and Systems
By: Chuan Seng Tan, Hao Yu , Hao (Ntu, S'pore) Yu, Chuan Seng (Ntu, S'pore) Tan, Chuan-Seng Tan
Publisher: World Scientific Publishing Company
No Review Yet
AED796
Binding:
Hardback
Release:
28 Oct 2015
Language:
English
Available
Ships within 9-10 Days Explain..
Free Shipping in UAE.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
2.
Advances in 3D Integrated Circuits and Systems
Advances in 3D Integrated Circuits and Systems
By: Chuan Seng Tan, Hao Yu , Hao (Ntu, S'pore) Yu, Chuan Seng (Ntu, S'pore) Tan, Chuan-Seng Tan
Publisher: World Scientific Publishing Company
No Review Yet
AED355
Binding:
Paperback
Release:
28 Oct 2015
Language:
English
Available
Ships within 9-10 Days Explain..
Free Shipping in UAE.
3.
3D Integration for VLSI Systems
3D Integration for VLSI Systems
By: Chuan Seng Tan, Kuan-Neng Chen, Chuan Seng (Nanyang Technological University, Singapore) Tan, Kuan-Neng (National Chiao Tung University, Hsinchu, Taiwan) Chen, Steven J. (IBM Research Division, Yorktown Heights, New York, USA) Koester
Publisher: Pan Stanford Publishing
No Review Yet
AED849
Binding:
Hardback
Release:
26 Sep 2011
Language:
English
Available
Ships within 20-22 Days Explain..
Free Shipping in UAE.
4.
Wafer Level 3-D ICS Process Technology
Wafer Level 3-D ICS Process Technology
By: Chuan Seng Tan, L. Rafael Reif, Ronald J. Gutmann, L Rafael Reif, Ronald J Gutmann
Publisher: Springer
No Review Yet
AED936
Binding:
Hardback
Release:
19 Sep 2008
Language:
English
Available
Ships within 9-10 Days Explain..
Free Shipping in UAE.
5.
Physical Design for 3D Integrated Circuits
Physical Design for 3D Integrated Circuits
By: Chuan Seng Tan, Aida Todri-Sanial, Krzysztof Iniewski, Aida (CNRS-LIRMM/University of Montpellier, France) Todri-Sanial
Publisher: Taylor and Francis
No Review Yet
AED763
Binding:
Paperback
Release:
02 Apr 2021
Language:
English
International Edition
Ships within 26-28 Days Explain..
Free Shipping in UAE.
6.
Stress Concentrations in Laminated Composites
Stress Concentrations in Laminated Composites
By: Seng-Chuan Tan, Seng C. Tan, Seng C Tan, Seng C. (Consultant, Dayton, Ohio, USA) Tan, Tan C Tan
Publisher: CRC Press
No Review Yet
AED2,910
Binding:
Paperback
Release:
10 Oct 1994
Language:
English
International Edition
Ships within 26-28 Days Explain..
Free Shipping in UAE.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
7.
Physical Design for 3D Integrated Circuits
Physical Design for 3D Integrated Circuits
By: Chuan Seng Tan, Aida Todri-Sanial, Krzysztof Iniewski, Chuan Seng (Nanyang Technological University, Singapore) Tan, Aida (CNRS-LIRMM/University of Montpellier, France) Todri-Sanial
Publisher: CRC Press
No Review Yet
AED1,841
Binding:
Hardback
Release:
18 Dec 2015
Language:
English
International Edition
Ships within 26-28 Days Explain..
Free Shipping in UAE.
8.
Wafer Level 3-D ICS Process Technology
Wafer Level 3-D ICS Process Technology
By: Chuan Seng Tan, L. Rafael Reif, Ronald J. Gutmann, L Rafael Reif, Ronald J Gutmann
Publisher: Springer
No Review Yet
AED1,582
Binding:
Paperback
Release:
08 Dec 2010
Language:
English
International Edition
Ships within 22-24 Days Explain..
Free Shipping in UAE.
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