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1.
Engineering Circuit Analysis
Engineering Circuit Analysis
By: Durbin, Steven M., Hayt, William H., Jr., Kemmerly, Jack E., Phillips, Jamie D.
Publisher: McGraw-Hill College
No Review Yet
AED848
Binding:
Bundle
Release:
1/25/2023
Language:
English
International Edition
Ships within 24-26 Days Explain..
2.
Loose Leaf for Engineering Circuit Analysis
Loose Leaf for Engineering Circuit Analysis
By: William H Hayt, Steven Durbin, William Hayt , Jack Kemmerly , Steven M Durbin
Publisher: McGraw-Hill Education
No Review Yet
AED633
Binding:
Loose-leaf
Release:
23 Mar 2018
Language:
English
Out of Stock
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3.
Package: Loose Leaf for Engineering Circuit Analysis with 1 Semester Connect Access Card
Package: Loose Leaf for Engineering Circuit Analysis with 1 Semester Connect Access Card
By: William H Hayt, Jack Kemmerly , Steven M Durbin
Publisher: McGraw-Hill Education
No Review Yet
AED1,002
Binding:
Loose-leaf
Release:
23 May 2012
Language:
English
Out of Stock
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4.
Loose Leaf Engineering Circuit Analysis
Loose Leaf Engineering Circuit Analysis
By: William H Hayt, Jack Kemmerly , Steven M Durbin
Publisher: McGraw-Hill Education
No Review Yet
AED879
Binding:
Loose-leaf
Release:
07 Aug 2012
Language:
English
Out of Stock
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