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Ehrenfried Zschech

Ehrenfried Zschech

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1.
Characterization of Nanomaterials
Characterization of Nanomaterials
By: Ehrenfried Zschech, Rodrigo Martins, Robert Sinclair
Publisher: Mdpi AG
No Review Yet
AED198
Binding:
Hardback
Release:
24 Aug 2021
Language:
English
International Edition
Ships within 14-16 Days Explain..
2.
Stress-Induced Phenomena in Metallization
Stress-Induced Phenomena in Metallization
By: Ehrenfried Zschech
Publisher: American Institute of Physics
No Review Yet
AED510
Binding:
Hardback
Release:
01 Feb 2006
Language:
English
Available
Ships within 1-2 Days Explain..
3.
Stress-Induced Phenomena in Metallization
Stress-Induced Phenomena in Metallization
By: Ehrenfried Zschech, Shinichi Ogawa, P S Ho
Publisher: American Institute of Physics
No Review Yet
AED258
Binding:
Hardback
Release:
13 Nov 2007
Language:
English
Available
Ships within 4-6 Days Explain..
4.
Materials for Information Technology
Materials for Information Technology
By: Ehrenfried Zschech, Caroline Whelan, Thomas Mikolajick
Publisher: Springer
No Review Yet
AED991
Binding:
Paperback
Release:
22 Oct 2010
Language:
English
International Edition
Ships within 12-14 Days Explain..
5.
Materials for Information Technology
Materials for Information Technology
By: Ehrenfried Zschech, Caroline Whelan, Thomas Mikolajick
Publisher: Springer
No Review Yet
AED591
Binding:
Hardback
Release:
01 Oct 2005
Language:
English
Available
Ships within 2-4 Days Explain..
6.
Advanced Interconnects for ULSI Technology
Advanced Interconnects for ULSI Technology
By: Mikhail Baklanov, Ehrenfried Zschech, Mikhail R. Baklanov, Paul S. Ho, Paul S Ho
Publisher: Wiley
No Review Yet
AED670
Binding:
Hardback
Release:
02 Apr 2012
Language:
English
Available
Ships within 1-2 Days Explain..
7.
Stress-Induced Phenomena in Metallization
Stress-Induced Phenomena in Metallization
By: Ehrenfried Zschech, Shinichi Ogawa, Paul S Ho
Publisher: American Institute of Physics
No Review Yet
AED150
Binding:
Hardback
Release:
01 Jun 2009
Language:
English
Out of Stock
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8.
Stress Management for 3D ICS Using Through Silicon Vias:
Stress Management for 3D ICS Using Through Silicon Vias:
By: Ehrenfried Zschech, Valeriy Sukharev, Larry Smith, Riko Radojcic
Publisher: American Institute of Physics
No Review Yet
AED586
Binding:
Paperback
Release:
23 Nov 2011
Language:
English
Out of Stock
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9.
Stress-Induced Phenomena in Metallization
Stress-Induced Phenomena in Metallization
By: Ehrenfried Zschech, Shinichi Ogawa, P S Ho
Publisher: American Institute of Physics
No Review Yet
AED682
Binding:
Hardback
Release:
20 Dec 2010
Language:
English
Out of Stock
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