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1.
Secure, Low-Power IoT Communication Using Edge-Coded Signaling
Secure, Low-Power IoT Communication Using Edge-Coded Signaling
By: Ibrahim (Abe) M. Elfadel, Shahzad Muzaffar, Elfadel
Publisher: Springer Nature Switzerland AG
No Review Yet
AED363
Binding:
Hardback
Release:
07 May 2022
Language:
English
International Edition
Ships within 14-16 Days Explain..
2.
Vlsi-Soc: Opportunities and Challenges Beyond the Internet of Things
Vlsi-Soc: Opportunities and Challenges Beyond the Internet of Things
By: Ibrahim (Abe) M. Elfadel, H. Fatih Ugurdag, Ricardo Reis, Matteo Sonza Reorda, Jose Monteiro
Publisher: Springer International Publishing
No Review Yet
AED261
Binding:
Paperback
Release:
14 Aug 2020
Language:
English
International Edition
Ships within 14-16 Days Explain..
3.
The Iot Physical Layer
The Iot Physical Layer
By: Ibrahim (Abe) M. Elfadel, Mohammed Ismail, Ibrahim (Abe) M Elfadel, Elfadel
Publisher: Springer
No Review Yet
AED558
Binding:
Paperback
Release:
19 Jan 2019
Language:
English
International Edition
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4.
Machine Learning in VLSI Computer-Aided Design
Machine Learning in VLSI Computer-Aided Design
By: Ibrahim (Abe) M. Elfadel, Xin Li, Duane S. Boning, Duane S Boning, Ibrahim (Abe) M Elfadel
Publisher: Springer
No Review Yet
AED759
Binding:
Hardback
Release:
27 Mar 2019
Language:
English
International Edition
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5.
MEMS Accelerometers
MEMS Accelerometers
By: Ibrahim (Abe) M Elfadel, Ha Duong Ngo, Mahmoud Rasras
Publisher: Mdpi AG
No Review Yet
AED240
Binding:
Paperback
Release:
27 May 2019
Language:
English
International Edition
Ships within 14-16 Days Explain..
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
6.
The Iot Physical Layer
The Iot Physical Layer
By: Ibrahim (Abe) M. Elfadel, Mohammed Ismail, Ibrahim (Abe) M Elfadel, Elfadel
Publisher: Springer
No Review Yet
AED462
Binding:
Hardback
Release:
13 Sep 2018
Language:
English
International Edition
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7.
3D Stacked Chips
3D Stacked Chips
By: Ibrahim (Abe) M. Elfadel, Gerhard Fettweis, Ibrahim (Abe) M Elfadel, Elfadel
Publisher: Springer
No Review Yet
AED243
Binding:
Paperback
Release:
26 May 2018
Language:
English
International Edition
Ships within 14-16 Days Explain..
8.
3D Stacked Chips
3D Stacked Chips
By: Ibrahim (Abe) M. Elfadel, Gerhard Fettweis, Ibrahim M. Elfadel, Ibrahim (Abe) M Elfadel, Elfadel
Publisher: Springer
No Review Yet
AED243
Binding:
Hardback
Release:
23 May 2016
Language:
English
International Edition
Ships within 14-16 Days Explain..
9.
Vlsi-Soc: Opportunities and Challenges Beyond the Internet of Things
Vlsi-Soc: Opportunities and Challenges Beyond the Internet of Things
By: Ibrahim (Abe) M. Elfadel, H. Fatih Ugurdag, Ricardo Reis, Matteo Sonza Reorda, Jose Monteiro
Publisher: Springer
No Review Yet
AED243
Binding:
Hardback
Release:
03 Jul 2019
Language:
English
Out of Stock
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10.
VLSI-SoC
VLSI-SoC
By: Sonza Reorda Matteo Sonza Reorda, Maniatakos Michail Maniatakos, Elfadel Ibrahim (Abe) M. Elfadel
Publisher: Springer Nature B.V.
No Review Yet
AED206
Binding:
Paperback
Release:
20 May 2019
Language:
English
Out of Stock
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11.
The IoT Physical Layer
The IoT Physical Layer
By: Ismail Mohammed Ismail, Elfadel Ibrahim (Abe) M. Elfadel
Publisher: Springer Nature B.V.
No Review Yet
AED206
Binding:
Paperback
Release:
06 Sep 2018
Language:
English
Out of Stock
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