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1.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: R. R. Tummala, Alan G. Klopfenstein, Eugene J. Rymaszewski, R R Tummala, Eugene J Rymaszewski
Publisher: Springer
No Review Yet
AED932
Binding:
Paperback
Release:
23 Oct 2012
Language:
English
International Edition
Ships within 24-26 Days Explain..
2.
Thin-Film Capacitors for Packaged Electronics
Thin-Film Capacitors for Packaged Electronics
By: Jain Pushkar, Eugene J Rymaszewski
Publisher: Springer
No Review Yet
AED467
Binding:
Paperback
Release:
23 Feb 2014
Language:
English
International Edition
Ships within 24-26 Days Explain..
3.
Thin-Film Capacitors for Packaged Electronics
Thin-Film Capacitors for Packaged Electronics
By: Jain Pushkar, Eugene J Rymaszewski
Publisher: Springer
No Review Yet
AED446
Binding:
Hardback
Release:
30 Nov 2003
Language:
English
Available
Ships within 2-4 Days Explain..
4.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, R R Tummala
Publisher: Springer
No Review Yet
AED935
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
International Edition
Ships within 24-26 Days Explain..
5.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, R R Tummala
Publisher: Springer
No Review Yet
AED1,548
Binding:
Paperback
Release:
31 Jan 1997
Language:
English
International Edition
Ships within 14-16 Days Explain..
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
6.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, R R Tummala
Publisher: Springer
No Review Yet
AED685
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
International Edition
Ships within 14-16 Days Explain..
7.
Microelectronics Packaging Handbook, 3-Part Set
Microelectronics Packaging Handbook, 3-Part Set
By: R R Tummala, Eugene J Rymaszewski, Alan G Klopfenstein
Publisher: Springer
No Review Yet
AED2,100
Binding:
Book
Release:
31 Jan 1997
Language:
English
Out of Stock
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8.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Tummala R.R. Tummala, Klopfenstein Alan G. Klopfenstein, Rymaszewski Eugene J. Rymaszewski
Publisher: Springer Nature B.V.
No Review Yet
AED206
Binding:
Paperback
Release:
14 May 2012
Language:
English
Out of Stock
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