Books written by Eugene J. Rymaszewski Bookswagon UAE
BooksWagon Icon
Logo1
Login & Sign up
AddBanner
Home icon Home
Account Icon Account
Wishlist Icon Wishlist
Cart Icon Cart
humburger icon Categories
Close

Refine your Search

Availability

Shipping Time

Source

Binding

Language

Publication Year

Filter By Category
Eugene J. Rymaszewski

Eugene J. Rymaszewski

9 results found
List viewGrid view
Sort By:
1.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: R. R. Tummala, Alan G. Klopfenstein, Eugene J. Rymaszewski, R R Tummala, Eugene J Rymaszewski
Publisher: Springer
No Review Yet
AED931
Binding:
Paperback
Release:
23 Oct 2012
Language:
English
International Edition
Ships within 12-14 Days Explain..
2.
Thin-Film Capacitors for Packaged Electronics
Thin-Film Capacitors for Packaged Electronics
By: Jain Pushkar, Eugene J Rymaszewski
Publisher: Springer
No Review Yet
AED467
Binding:
Paperback
Release:
23 Feb 2014
Language:
English
International Edition
Ships within 12-14 Days Explain..
3.
Thin-Film Capacitors for Packaged Electronics
Thin-Film Capacitors for Packaged Electronics
By: Jain Pushkar, Eugene J Rymaszewski
Publisher: Springer
No Review Yet
AED446
Binding:
Hardback
Release:
30 Nov 2003
Language:
English
Available
Ships within 2-4 Days Explain..
4.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, R R Tummala
Publisher: Springer
No Review Yet
AED931
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
International Edition
Ships within 12-14 Days Explain..
5.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, R R Tummala
Publisher: Springer
No Review Yet
AED1,548
Binding:
Paperback
Release:
31 Jan 1997
Language:
English
International Edition
Ships within 14-16 Days Explain..
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
6.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, R R Tummala
Publisher: Springer
No Review Yet
AED685
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
International Edition
Ships within 14-16 Days Explain..
7.
Microelectronics Packaging Handbook on CD-ROM
Microelectronics Packaging Handbook on CD-ROM
By: R. R. Tummala, Alan G. Klopfenstein, Eugene J. Rymaszewski, R R Tummala, Eugene J Rymaszewski
Publisher: Springer
No Review Yet
AED191
Binding:
CD-ROM
Release:
31 Mar 1998
Language:
English
Available
Ships within 1-2 Days Explain..
8.
Microelectronics Packaging Handbook, 3-Part Set
Microelectronics Packaging Handbook, 3-Part Set
By: R R Tummala, Eugene J Rymaszewski, Alan G Klopfenstein
Publisher: Springer
No Review Yet
AED2,100
Binding:
Book
Release:
31 Jan 1997
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
9.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
By: Tummala R.R. Tummala, Klopfenstein Alan G. Klopfenstein, Rymaszewski Eugene J. Rymaszewski
Publisher: Springer Nature B.V.
No Review Yet
AED206
Binding:
Paperback
Release:
14 May 2012
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
No more records found