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Gilbert B. Chapman II

Gilbert B. Chapman II

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Nondestructive Evaluation of Adhesive Bonds Using 20 MHz and 25 Khz Ultrasonic Frequencies on Metal and Polymer Assemblies
Nondestructive Evaluation of Adhesive Bonds Using 20 MHz and 25 Khz Ultrasonic Frequencies on Metal and Polymer Assemblies
By: Gilbert B. Chapman II, Gilbert B Chapman II, Gilbert B, II Chapman, Gilbert B Chapman
Publisher: Authorhouse
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AED495
Binding:
Paperback
Release:
17 Jul 2014
Language:
English
International Edition
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