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Jack K Williams

Jack K Williams

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1.
Engineering Circuit Analysis
Engineering Circuit Analysis
By: Durbin, Steven M., Hayt, William H., Jr., Kemmerly, Jack E., Phillips, Jamie D.
Publisher: McGraw-Hill College
No Review Yet
AED848
Binding:
Bundle
Release:
1/25/2023
Language:
English
International Edition
Ships within 24-26 Days Explain..
2.
Dueling in the Old South
Dueling in the Old South
By: Jack K Williams
Publisher: Texas A&M University Press
No Review Yet
AED82
Binding:
Paperback
Release:
01 Jun 2000
Language:
English
International Edition
Ships within 12-14 Days Explain..
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
3.
Scraplands
Scraplands
By: Jack William Orme Braxton, (A K A) Jackofheart, J W O Braxton
Publisher: Amazon Digital Services LLC - Kdp
No Review Yet
AED52
Binding:
Paperback
Release:
21 Aug 2023
Language:
English
Out of Stock
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4.
Loose Leaf for Engineering Circuit Analysis
Loose Leaf for Engineering Circuit Analysis
By: William H Hayt, Steven Durbin, William Hayt , Jack Kemmerly , Steven M Durbin
Publisher: McGraw-Hill Education
No Review Yet
AED633
Binding:
Loose-leaf
Release:
23 Mar 2018
Language:
English
Out of Stock
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5.
Economic lot Size Determination in Multistage Assembly Systems
Economic lot Size Determination in Multistage Assembly Systems
By: Wallace B S Crowston, M H Wagner, Jack F Williams
Publisher: Creative Media Partners, LLC
No Review Yet
AED66
Binding:
Paperback
Release:
20 Feb 2018
Language:
English
Out of Stock
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6.
Critical Care
Critical Care
By: Jack Tinker, William J Sibbald, Doreen R G Browne
Publisher: Hodder Education Publishers
No Review Yet
AED486
Binding:
Hardback
Release:
25 Jan 1996
Language:
English
Out of Stock
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7.
Package: Loose Leaf for Engineering Circuit Analysis with 1 Semester Connect Access Card
Package: Loose Leaf for Engineering Circuit Analysis with 1 Semester Connect Access Card
By: William H Hayt, Jack Kemmerly , Steven M Durbin
Publisher: McGraw-Hill Education
No Review Yet
AED1,002
Binding:
Loose-leaf
Release:
23 May 2012
Language:
English
Out of Stock
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8.
Loose Leaf Engineering Circuit Analysis
Loose Leaf Engineering Circuit Analysis
By: William H Hayt, Jack Kemmerly , Steven M Durbin
Publisher: McGraw-Hill Education
No Review Yet
AED879
Binding:
Loose-leaf
Release:
07 Aug 2012
Language:
English
Out of Stock
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9.
Essentials of Clinical Mycology
Essentials of Clinical Mycology
By: William E. Dismukes, Peter G. Pappas, Jack D. Sobel, Carol A. Kauffman, Dr. Jack D. Sobel
Publisher: Springer
No Review Yet
AED349
Binding:
Hardback
Release:
13 Jan 2011
Language:
English
Out of Stock
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