Buy books written by John H Lau Available at Bookswagon UAE
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John H Lau

John H Lau

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1.
Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
By: John H. Lau, John H Lau
Publisher: Springer Nature Singapore
No Review Yet
AED1,146
Binding:
Hardback
Release:
28 Mar 2023
Language:
English
Out of Stock
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2.
Assembly and Reliability of Lead-Free Solder Joints
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee, John H Lau
Publisher: Springer
No Review Yet
AED1,066
Binding:
Hardback
Release:
30 May 2020
Language:
English
Out of Stock
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3.
Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
AED658
Binding:
Paperback
Release:
16 Dec 2018
Language:
English
Out of Stock
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4.
Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
By: John H Lau
Publisher: Springer Nature Singapore
No Review Yet
AED1,199
Binding:
Paperback
Release:
29 Mar 2024
Language:
English
Out of Stock
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5.
Heterogeneous Integrations
Heterogeneous Integrations
By: Lau John H. Lau
Publisher: Springer Nature B.V.
No Review Yet
AED481
Binding:
Paperback
Release:
06 Apr 2019
Language:
English
Out of Stock
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6.
Heterogeneous Integrations
Heterogeneous Integrations
By: John H Lau
Publisher: Springer Nature Customer Service Center Gmbh
No Review Yet
AED1,199
Binding:
Paperback
Release:
04 Jun 2019
Language:
English
Out of Stock
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