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Veterinary medicine
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John H Lauerman
18
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1.
Semiconductor Advanced Packaging
By:
John H. Lau
,
John H Lau
Publisher:
Springer Verlag, Singapore
No Review Yet
AED812
Binding:
Paperback
Release:
19 May 2022
Language:
English
In Stock
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9-10 Days
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2.
Chip on Board
By:
John H Lau
Publisher:
Springer
No Review Yet
AED1,316
Binding:
Hardback
Release:
30 Jun 1994
Language:
English
Available
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9-10 Days
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3.
Chiplet Design and Heterogeneous Integration Packaging
By:
Lau John H. Lau
Publisher:
Springer Nature B.V.
No Review Yet
AED530
Binding:
Paperback
Release:
28 Mar 2023
Language:
English
International Edition
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22-24 Days
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4.
Semiconductor Advanced Packaging
By:
John H. Lau
,
John H Lau
Publisher:
Springer
No Review Yet
AED1,596
Binding:
Hardback
Release:
02 Aug 2021
Language:
English
International Edition
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22-24 Days
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5.
Assembly and Reliability of Lead-Free Solder Joints
By:
John H. Lau
,
Ning-Cheng Lee
,
John H Lau
Publisher:
Springer
No Review Yet
AED1,316
Binding:
Paperback
Release:
13 Jun 2021
Language:
English
International Edition
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20-22 Days
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6.
Heterogeneous Integrations
By:
John H. Lau
,
John H Lau
Publisher:
Springer
No Review Yet
AED1,465
Binding:
Hardback
Release:
12 Apr 2019
Language:
English
International Edition
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7.
Fan-Out Wafer-Level Packaging
By:
John H. Lau
,
John H Lau
Publisher:
Springer
No Review Yet
AED1,349
Binding:
Hardback
Release:
10 May 2018
Language:
English
International Edition
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22-24 Days
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8.
Solder Joint Reliability
By:
John H. Lau
,
John H Lau
Publisher:
Springer
No Review Yet
AED2,172
Binding:
Hardback
Release:
31 May 1991
Language:
English
International Edition
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32-34 Days
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9.
Solder Joint Reliability
By:
John H. Lau
,
John H Lau
Publisher:
Springer
No Review Yet
AED2,168
Binding:
Paperback
Release:
23 Feb 2014
Language:
English
International Edition
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20-22 Days
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10.
Handbook of Tape Automated Bonding
By:
John H Lau
Publisher:
Springer
No Review Yet
AED2,175
Binding:
Hardback
Release:
31 Jan 1992
Language:
English
International Edition
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32-34 Days
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11.
Mechanics of Solder Alloy Interconnects
By:
John H Lau
,
Darrel R Frear
,
Harold S Morgan
,
Steven N Burchett
Publisher:
Springer
No Review Yet
AED2,170
Binding:
Hardback
Release:
31 Jan 1994
Language:
English
International Edition
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22-24 Days
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12.
Chiplet Design and Heterogeneous Integration Packaging
By:
John H. Lau
,
John H Lau
Publisher:
Springer Nature Singapore
No Review Yet
AED1,146
Binding:
Hardback
Release:
28 Mar 2023
Language:
English
Out of Stock
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13.
Assembly and Reliability of Lead-Free Solder Joints
By:
John H. Lau
,
Ning-Cheng Lee
,
John H Lau
Publisher:
Springer
No Review Yet
AED1,066
Binding:
Hardback
Release:
30 May 2020
Language:
English
Out of Stock
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14.
Fan-Out Wafer-Level Packaging
By:
John H. Lau
,
John H Lau
Publisher:
Springer
No Review Yet
AED658
Binding:
Paperback
Release:
16 Dec 2018
Language:
English
Out of Stock
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15.
Chiplet Design and Heterogeneous Integration Packaging
By:
John H Lau
Publisher:
Springer Nature Singapore
No Review Yet
AED1,199
Binding:
Paperback
Release:
29 Mar 2024
Language:
English
Out of Stock
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16.
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
By:
John H Lau
Publisher:
Springer Nature Singapore
No Review Yet
AED1,538
Binding:
Hardback
Release:
18 Aug 2024
Language:
English
Out of Stock
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17.
Heterogeneous Integrations
By:
Lau John H. Lau
Publisher:
Springer Nature B.V.
No Review Yet
AED481
Binding:
Paperback
Release:
06 Apr 2019
Language:
English
Out of Stock
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18.
Heterogeneous Integrations
By:
John H Lau
Publisher:
Springer Nature Customer Service Center Gmbh
No Review Yet
AED1,199
Binding:
Paperback
Release:
04 Jun 2019
Language:
English
Out of Stock
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