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Flat 10% Off Upto 10AED - Use Code FLAT10

Purchase Any Book And Get 5AED Off - Use Code FIRST

Flat 10% Off Upto 10AED - Use Code FLAT10

Purchase Any Book And Get 5AED Off - Use Code FIRST

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Kim S Siow

Kim S Siow

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Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
By: Kim S Siow, Kim S. Siow
Publisher: Springer
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AED1,640
Binding:
Hardback
Release:
07 Feb 2019
Language:
English
International Edition
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