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Manvinder Sharma

Manvinder Sharma

6 results found
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1.
Kornstrukturen und Auswirkungen von Spannungen auf Korngrenzen
Kornstrukturen und Auswirkungen von Spannungen auf Korngrenzen
By: Manvinder Sharma
Publisher: KS Omniscriptum Publishing
No Review Yet
AED201
Binding:
Paperback
Release:
30 Jan 2023
Language:
German
International Edition
Ships within 14-16 Days Explain..
2.
Structures des grains et effets des contraintes sur les limites des grains
Structures des grains et effets des contraintes sur les limites des grains
By: Manvinder Sharma
Publisher: KS Omniscriptum Publishing
No Review Yet
AED201
Binding:
Paperback
Release:
30 Jan 2023
Language:
French
International Edition
Ships within 14-16 Days Explain..
3.
Estruturas de Grãos e Efeitos do Stress sobre os Limites dos Grãos
Estruturas de Grãos e Efeitos do Stress sobre os Limites dos Grãos
By: Manvinder Sharma
Publisher: KS Omniscriptum Publishing
No Review Yet
AED201
Binding:
Paperback
Release:
30 Jan 2023
Language:
Portuguese
International Edition
Ships within 14-16 Days Explain..
4.
Strutture dei grani ed effetti delle sollecitazioni sui confini dei grani
Strutture dei grani ed effetti delle sollecitazioni sui confini dei grani
By: Manvinder Sharma
Publisher: KS Omniscriptum Publishing
No Review Yet
AED201
Binding:
Paperback
Release:
30 Jan 2023
Language:
Italian
International Edition
Ships within 14-16 Days Explain..
5.
Design of Hybrid Compression Model using MATLAB
Design of Hybrid Compression Model using MATLAB
By: Dishant Khosla, Manvinder Sharma
Publisher: KS Omniscriptum Publishing
No Review Yet
AED174
Binding:
Paperback
Release:
15 Jun 2018
Language:
English
International Edition
Ships within 14-16 Days Explain..
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
6.
Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds
Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds
By: Harjinder Singh, Amandeep Singh Sappal, Manvinder Sharma, Dr Harjinder Singh, Dr Amandeep Singh Sappal
Publisher: KS Omniscriptum Publishing
No Review Yet
AED174
Binding:
Paperback
Release:
19 Jun 2018
Language:
English
International Edition
Ships within 14-16 Days Explain..
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
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