Books written by Michael (University of Maryland, College Park) Pecht
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Michael (University of Maryland, College Park) Pecht

Michael (University of Maryland, College Park) Pecht

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1.
Handbook of Electronic Package Design
Handbook of Electronic Package Design
By: Pecht Pecht, Michael Pecht, Michael (University of Maryland, College Park, USA) Pecht, Lynn (Battelle, Columbus, Ohio, USA) Faulkner, Michael (University of Maryland, College Park, USA University of Maryland, College Park, USA) Pecht
Publisher: Taylor & Francis Inc
No Review Yet
AED948
Binding:
Hardback
Release:
16 Aug 1991
Language:
English
Available
Ships within 4-6 Days Explain..
2.
Electronics Industry in Taiwan
Electronics Industry in Taiwan
By: Chung-Shing Lee, Michael Pecht, Michael (University of Maryland, College Park, USA) Pecht, Chung-Shing (Pacific Lutheran University, Tacoma, Washington, USA) Lee, Michael (University of Maryland, College Park, USA University of Maryland, College Park, USA) Pecht
Publisher: Taylor & Francis
No Review Yet
AED847
Binding:
Hardback
Release:
18 Dec 2020
Language:
English
International Edition
Ships within 18-20 Days Explain..
3.
Placement and Routing of Electronic Modules
Placement and Routing of Electronic Modules
By: Michael Pecht, Michael (University of Maryland, College Park, USA) Pecht, Michael (University of Maryland, College Park, USA University of Maryland, College Park, USA) Pecht
Publisher: Taylor and Francis
No Review Yet
AED333
Binding:
Paperback
Release:
05 Sep 2019
Language:
English
International Edition
Ships within 18-20 Days Explain..
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
4.
Product Reliability, Maintainability, and Supportability Handbook
Product Reliability, Maintainability, and Supportability Handbook
By: Michael Pecht, Michael (University of Maryland, College Park, USA) Pecht, Michael (University of Maryland, College Park, USA University of Maryland, College Park, USA) Pecht
Publisher: CRC Press
No Review Yet
AED399
Binding:
Hardback
Release:
01 Apr 2009
Language:
English
Available
Ships within 1-2 Days Explain..
5.
Soldering Processes and Equipment
Soldering Processes and Equipment
By: Michael Pecht, Michael G Pecht, Pecht, MG Pecht, Michael (University of Maryland, College Park) Pecht
Publisher: Wiley-Interscience
No Review Yet
AED636
Binding:
Hardback
Release:
18 Jun 1993
Language:
English
International Edition
Ships within 14-16 Days Explain..
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
6.
Guidebook for Managing Silicon Chip Reliability
Guidebook for Managing Silicon Chip Reliability
By: Michael Pecht, Riko Radojcic, Gopal Rao, Michael G. Pecht, Michael (University of Maryland, College Park, USA) Pecht
Publisher: Taylor & Francis Inc
No Review Yet
AED367
Binding:
Hardback
Release:
29 Dec 1998
Language:
English
Available
Ships within 1-2 Days Explain..
7.
Japanese Electronics Industry
Japanese Electronics Industry
By: Watura Nakayama, Wataru Nakayama, Michael Pecht, William Boulton, Michael (University of Maryland, College Park, USA) Pecht
Publisher: CRC Press
No Review Yet
AED333
Binding:
Paperback
Release:
27 Jun 1999
Language:
English
Available
Ships within 12-14 Days Explain..
8.
Japanese Electronics Industry
Japanese Electronics Industry
By: Wataru Nakayama, Michael Pecht, William Boulton, Michael (University of Maryland, College Park, USA) Pecht, Wataru (ThermTech International, Kanagawa, Japan) Nakayama
Publisher: CRC Press
No Review Yet
AED539
Binding:
Hardback
Release:
28 Jun 2018
Language:
English
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