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1.
Encapsulation Technologies for Electronic Applications
Encapsulation Technologies for Electronic Applications
By: Haleh Ardebili, Michael Pecht, Michael G Pecht, Michael (CALCE (Center for Advanced Life Cycle Engineering), University of Maryland, USA) Pecht, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University) Ardebili
Publisher: William Andrew
No Review Yet
AED538
Binding:
Hardback
Release:
01 Jun 2009
Language:
English
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2.
Electrical Connectors
Electrical Connectors
By: Michael G. Pecht, Michael G Pecht, San Kyeong, S Kyeong, Michael G. (University of Maryland) Pecht
Publisher: Wiley
No Review Yet
AED444
Binding:
Hardback
Release:
29 Dec 2020
Language:
English
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