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Michael M Pecht

Michael M Pecht

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1.
Influence of Temperature on Microelectronics and System Reliability
Influence of Temperature on Microelectronics and System Reliability
By: Michael Pecht, Edward B. Hakim, Michael G. Pecht, Pradeep Lall, Michael G Pecht
Publisher: CRC Press
No Review Yet
AED1,316
Binding:
Hardback
Release:
24 Apr 1997
Language:
English
Available
Ships within 20-22 Days Explain..
Free Shipping in UAE.
2.
Lead-Free Electronics
Lead-Free Electronics
By: Sanka Ganesan, Ganesan, Michael G. Pecht, Michael G Pecht, Pecht
Publisher: Wiley-Interscience
No Review Yet
AED1,631
Binding:
Hardback
Release:
01 Mar 2006
Language:
English
International Edition
Ships within 26-28 Days Explain..
Free Shipping in UAE.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
3.
Risk-Based Engineering
Risk-Based Engineering
By: Michael G. Pecht, Prabhakar V. Varde, Michael G Pecht, Prabhakar V Varde, Michael G (University of Maryland) Pecht
Publisher: Springer
No Review Yet
AED940
Binding:
Paperback
Release:
19 Jan 2019
Language:
English
International Edition
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4.
Risk-Based Engineering
Risk-Based Engineering
By: Michael G. Pecht, Prabhakar V. Varde, Michael G Pecht, Prabhakar V Varde
Publisher: Springer
No Review Yet
AED530
Binding:
Hardback
Release:
24 Aug 2018
Language:
English
International Edition
Ships within 18-20 Days Explain..
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Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
5.
Guidebook for Managing Silicon Chip Reliability
Guidebook for Managing Silicon Chip Reliability
By: Michael Pecht, Riko Radojcic, Gopal Rao, Michael G. Pecht, Michael (University of Maryland, College Park, USA) Pecht
Publisher: Taylor & Francis Inc
No Review Yet
AED856
Binding:
Hardback
Release:
29 Dec 1998
Language:
English
Available
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6.
Encapsulation Technologies for Electronic Applications
Encapsulation Technologies for Electronic Applications
By: Haleh Ardebili, Michael Pecht, Michael G Pecht, Michael (CALCE (Center for Advanced Life Cycle Engineering), University of Maryland, USA) Pecht, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University) Ardebili
Publisher: William Andrew
No Review Yet
AED1,468
Binding:
Hardback
Release:
01 Jun 2009
Language:
English
Available
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7.
Singapore and Malaysia Electronics Industries
Singapore and Malaysia Electronics Industries
By: Donald Beane, Pecht Michael G., Anand Shukla
Publisher: CRC Press
No Review Yet
AED266
Binding:
Paperback
Release:
1997
Language:
English
Available
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8.
Contamination of Electronic Assemblies
Contamination of Electronic Assemblies
By: Au, Elissa M. Bumiller, Joan Pecht, Michael Pecht, Elissa M. (University of Maryland Bumiller
Publisher: Taylor & Francis Inc
No Review Yet
AED1,822
Binding:
Hardback
Release:
12 Nov 2002
Language:
English
Available
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9.
Copper Wire Bonding
Copper Wire Bonding
By: Zhaowei Zhong, Zhaowei W. Zhong, Michael G. Pecht, Preeti S. Chauhan, Anupam Choubey
Publisher: Springer
No Review Yet
AED1,062
Binding:
Hardback
Release:
20 Sep 2013
Language:
English
Available
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10.
Electronic Packaging Materials and Their Properties
Electronic Packaging Materials and Their Properties
By: Patrick McCluskey, Rakesh Agarwal, Michael G. (EDT) Pecht, Terrance Dishongh, Sirus Javadpour
Publisher: Taylor & Francis Inc
No Review Yet
AED1,148
Binding:
Hardback
Release:
18 Dec 1998
Language:
English
Available
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11.
Nature-Inspired Computing Paradigms in Systems
Nature-Inspired Computing Paradigms in Systems
By: Michael Pecht, Mohamed Arezki Mellal, Michael G Pecht, Michael (CALCE (Center for Advanced Life Cycle Engineering), University of Maryland, USA) Pecht, Michael M Pecht
Publisher: Elsevier Science
No Review Yet
AED996
Binding:
Paperback
Release:
01 Jul 2021
Language:
English
International Edition
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12.
Electrical Connectors
Electrical Connectors
By: Michael G. Pecht, Michael G Pecht, San Kyeong, S Kyeong, Michael G. (University of Maryland) Pecht
Publisher: Wiley
No Review Yet
AED1,302
Binding:
Hardback
Release:
29 Dec 2020
Language:
English
International Edition
Ships within 26-28 Days Explain..
Free Shipping in UAE.
13.
Guidebook for Managing Silicon Chip Reliability
Guidebook for Managing Silicon Chip Reliability
By: Michael Pecht, Riko Radojcic, Gopal Rao, Michael G. Pecht, Michael G Pecht
Publisher: Taylor and Francis
No Review Yet
AED523
Binding:
Paperback
Release:
07 Oct 2019
Language:
English
International Edition
Ships within 26-28 Days Explain..
Free Shipping in UAE.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
14.
Influence of Temperature on Microelectronics and System Reliability
Influence of Temperature on Microelectronics and System Reliability
By: Michael Pecht, Edward B. Hakim, Michael G. Pecht, Pradeep Lall, Michael G Pecht
Publisher: Taylor and Francis
No Review Yet
AED525
Binding:
Paperback
Release:
21 Jun 2019
Language:
English
International Edition
Ships within 26-28 Days Explain..
Free Shipping in UAE.
15.
Prognostics and Health Management of Electronics
Prognostics and Health Management of Electronics
By: Michael G. Pecht, Myeongsu Kang, Michael G Pecht, MG Pecht, Michael G. (University of Maryland) Pecht
Publisher: Wiley-IEEE Press
No Review Yet
AED1,435
Binding:
Hardback
Release:
01 Oct 2018
Language:
English
International Edition
Ships within 22-24 Days Explain..
Free Shipping in UAE.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
16.
Encapsulation Technologies for Electronic Applications
Encapsulation Technologies for Electronic Applications
By: Haleh Ardebili, Michael Pecht, Michael G Pecht, James J Licari, Jiawei Zhang
Publisher: William Andrew
No Review Yet
AED2,483
Binding:
Paperback
Release:
11 Oct 2018
Language:
English
International Edition
Ships within 22-24 Days Explain..
Free Shipping in UAE.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
17.
Soldering Processes and Equipment
Soldering Processes and Equipment
By: Michael Pecht, Michael G Pecht, Pecht, MG Pecht, Michael (University of Maryland, College Park) Pecht
Publisher: Wiley-Interscience
No Review Yet
AED1,484
Binding:
Hardback
Release:
18 Jun 1993
Language:
English
International Edition
Ships within 22-24 Days Explain..
Free Shipping in UAE.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
18.
China's Electronics Industry
China's Electronics Industry
By: Michael Pecht, Michael G Pecht, Michael (CALCE (Center for Advanced Life Cycle Engineering), University of Maryland, USA) Pecht, Michael M Pecht, Michael M. (CALCE (Center for Advanced Life Cycle Engineering), University of Maryland, USA) Pecht
Publisher: William Andrew
No Review Yet
AED2,847
Binding:
Paperback
Release:
31 Dec 2006
Language:
English
International Edition
Ships within 26-28 Days Explain..
Free Shipping in UAE.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
19.
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
By: Michael Pecht, Pecht, M Pecht
Publisher: Wiley-Interscience
No Review Yet
AED1,766
Binding:
Hardback
Release:
01 Mar 1994
Language:
English
International Edition
Ships within 22-24 Days Explain..
Free Shipping in UAE.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
20.
Optimum Cooling of Data Centers
Optimum Cooling of Data Centers
By: Diganta Das, Diganta Bhusan Das, Michael G. Pecht, Michael M. Ohadi, Jun Dai
Publisher: Springer
No Review Yet
AED1,094
Binding:
Hardback
Release:
21 Nov 2013
Language:
English
International Edition
Ships within 32-34 Days Explain..
Free Shipping in UAE.
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