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1.
Advanced Interconnects for ULSI Technology
Advanced Interconnects for ULSI Technology
By: Mikhail Baklanov, Ehrenfried Zschech, Mikhail R. Baklanov, Paul S. Ho, Paul S Ho
Publisher: Wiley
No Review Yet
AED958
Binding:
Hardback
Release:
02 Apr 2012
Language:
English
International Edition
Ships within 24-26 Days Explain..
2.
Electronic Packaging Materials Science V: Volume 203
Electronic Packaging Materials Science V: Volume 203
By: Paul S. Ho, Edwin D. Lillie, Ralph Jaccodine, Kenneth Jackson, Ralph J. Jaccodine
Publisher: Cambridge University Press
No Review Yet
AED118
Binding:
Hardback
Release:
07 Jun 1991
Language:
English
Out of Stock
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3.
Stress-Induced Phenomena in Metallization
Stress-Induced Phenomena in Metallization
By: Paul Totta, Paul Tuha, Che-Yu Li, C y Li, Paul S Ho
Publisher: American Institute of Physics
No Review Yet
AED529
Binding:
Hardback
Release:
14 Apr 2000
Language:
English
Out of Stock
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4.
Stress-Induced Phenomena in Metallization
Stress-Induced Phenomena in Metallization
By: Eduard Arzt, Paul S Ho, Shefford P Baker, Matti A Korhonen
Publisher: American Institute of Physics
No Review Yet
AED79
Binding:
Hardback
Release:
09 Apr 2002
Language:
English
Out of Stock
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5.
Materials Reliability in Microelectronics III: Volume 309
Materials Reliability in Microelectronics III: Volume 309
By: William F. Filter, Paul S. (University of Texas, Austin) Ho, Harold J. (Dartmouth College, New Hampshire) Frost, Harold J Frost, Kenneth P Rodbell
No Review Yet
AED94
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6.
Materials Reliability Issues in Microelectronics: Volume 225
Materials Reliability Issues in Microelectronics: Volume 225
By: James R. Lloyd, Paul S. (IBM T J Watson Research Center, New York) Ho, Frederick G. Yost, James R Lloyd, Paul S Ho
Publisher: Cambridge University Press
No Review Yet
AED128
Binding:
Hardback
Release:
22 Oct 1991
Language:
English
Out of Stock
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7.
Stress-Induced Phenomena in Metallization
Stress-Induced Phenomena in Metallization
By: Tomoji Nakamura, Cynthia A Volkert, Paul S Ho, Shefford P Baker
Publisher: American Institute of Physics
No Review Yet
AED596
Binding:
Hardback
Release:
01 Dec 2004
Language:
English
Out of Stock
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8.
Stress-Induced Phenomena in Metallization
Stress-Induced Phenomena in Metallization
By: Ehrenfried Zschech, Shinichi Ogawa, Paul S Ho
Publisher: American Institute of Physics
No Review Yet
AED143
Binding:
Hardback
Release:
01 Jun 2009
Language:
English
Out of Stock
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9.
Stress-Induced Phenomena in Metallization
Stress-Induced Phenomena in Metallization
By: John Sanchez, Che-Yu Li, John Bravman, Paul S Ho
Publisher: American Institute of Physics
No Review Yet
AED613
Binding:
Hardback
Release:
15 Apr 1998
Language:
English
Out of Stock
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10.
Electronic Packaging Materials Science VI: Volume 264
Electronic Packaging Materials Science VI: Volume 264
By: Che-Yu Li, Che-Yu (Cornell University, New York) Li, Paul S. (University of Texas, Austin) Ho, Kenneth A. (University of Arizona) Jackson, G. Ferris Lipscomb
Publisher: Materials Research Society
No Review Yet
AED104
Binding:
Hardback
Release:
12 Nov 1992
Language:
English
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