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1.
Materials Reliability in Microelectronics III: Volume 309
Materials Reliability in Microelectronics III: Volume 309
By: William F. Filter, Paul S. (University of Texas, Austin) Ho, Harold J. (Dartmouth College, New Hampshire) Frost, Harold J Frost, Kenneth P Rodbell
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AED94
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2.
Electronic Packaging Materials Science VI: Volume 264
Electronic Packaging Materials Science VI: Volume 264
By: Che-Yu Li, Che-Yu (Cornell University, New York) Li, Paul S. (University of Texas, Austin) Ho, Kenneth A. (University of Arizona) Jackson, G. Ferris Lipscomb
Publisher: Materials Research Society
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AED104
Binding:
Hardback
Release:
12 Nov 1992
Language:
English
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