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1.
Handbook of 3D Integration, Volume 4
Handbook of 3D Integration, Volume 4
By: Philip E. Garrou, Paul D. Franzon, Philip Garrou , Mitsumasa Koyanagi, Peter Ramm
Publisher: Wiley-vch
No Review Yet
AED612
Binding:
Hardback
Release:
06 May 2019
Language:
English
Out of Stock
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2.
Handbook of Wafer Bonding
Handbook of Wafer Bonding
By: Ramm, James Jian Lu, Maaike M. V. Taklo, James Jian-Qiang Lu, Peter Ramm
Publisher: Wiley-vch
No Review Yet
AED646
Binding:
Hardback
Release:
13 Feb 2012
Language:
English
Out of Stock
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Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
3.
Handbook of 3D Integration, Volumes 1 and 2
Handbook of 3D Integration, Volumes 1 and 2
By: Philip E. Garrou, Christopher Bower, Philip Garrou , Peter Ramm, Christopher (Semprius Inc., Raleigh, USA) Bower
Publisher: Wiley-vch
No Review Yet
AED632
Binding:
Paperback
Release:
22 Oct 2012
Language:
English
Out of Stock
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