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Ramani Mayappan

Ramani Mayappan

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1.
Intermetallic Study Between Sn-AG-Cu-Zn Solders and Copper Substrate
Intermetallic Study Between Sn-AG-Cu-Zn Solders and Copper Substrate
By: Ramani Mayappan
Publisher: Lap Lambert Academic Publishing
No Review Yet
AED471
Binding:
Paperback
Release:
27 Sep 2011
Language:
English
Out of Stock
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Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
2.
Interaction of Sn-9zn and Sn-8zn-3bi Lead-Free on Copper Metallization
Interaction of Sn-9zn and Sn-8zn-3bi Lead-Free on Copper Metallization
By: Ramani Mayappan
Publisher: Lap Lambert Academic Publishing
No Review Yet
AED614
Binding:
Paperback
Release:
02 Aug 2010
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
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