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Seonho Seok

Seonho Seok

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1.
MEMS Packaging Technologies and 3D Integration
MEMS Packaging Technologies and 3D Integration
By: Seonho Seok
Publisher: Mdpi AG
No Review Yet
AED565
Binding:
Hardback
Release:
01 Jun 2022
Language:
English
International Edition
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2.
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
By: Seonho Seok
Publisher: Springer
No Review Yet
AED987
Binding:
Paperback
Release:
05 Jan 2019
Language:
English
Out of Stock
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3.
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
By: Seonho Seok
Publisher: Springer
No Review Yet
AED987
Binding:
Hardback
Release:
14 May 2018
Language:
English
Out of Stock
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4.
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
By: Seok Seonho Seok
Publisher: Springer Nature B.V.
No Review Yet
AED481
Binding:
Paperback
Release:
03 May 2018
Language:
English
Out of Stock
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