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Flat 10% Off Upto 10AED - Use Code FLAT10

Purchase Any Book And Get 5AED Off - Use Code FIRST

Flat 10% Off Upto 10AED - Use Code FLAT10

Purchase Any Book And Get 5AED Off - Use Code FIRST

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1.
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
By: Beth Keser, Steffen Kroehnert, Steffen Kröhnert, B Keser
Publisher: John Wiley and Sons Ltd
No Review Yet
AED449
Binding:
Hardback
Release:
04 Jan 2022
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
By: Beth Keser, Steffen Kroehnert, Steffen Kröhnert, Keser, B Keser
Publisher: Wiley-IEEE Press
No Review Yet
AED544
Binding:
Hardback
Release:
12 Feb 2019
Language:
English
International Edition
Ships within 18-20 Days Explain..
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