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1.
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
By: Ephraim Suhir, Ephraim (Portland State University, Portland, USA) Suhir
Publisher: Taylor and Francis
No Review Yet
AED1,083
Binding:
Hardback
Release:
28 Jan 2021
Language:
English
Available
Ships within 20-22 Days Explain..
Free Shipping in UAE.
2.
Human-in-the-Loop
Human-in-the-Loop
By: Ephraim Suhir, Ephraim (Portland State University, Portland, USA) Suhir
Publisher: CRC Press
No Review Yet
AED1,157
Binding:
Hardback
Release:
05 Apr 2018
Language:
English
Available
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3.
Mechanical Behavior of Materials and Structures in Microelectronics: Volume 226
Mechanical Behavior of Materials and Structures in Microelectronics: Volume 226
By: Ephraim Suhir, Robert C Cammarata, Deborah D L Chung, Masahiro Jono
Publisher: Cambridge University Press
No Review Yet
AED306
Binding:
Hardback
Release:
01 Jan 1991
Language:
English
Available
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4.
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
By: Y.C. Lee, C.P. Wong, Ephraim Suhir, Y C Lee, C P Wong
Publisher: Springer
No Review Yet
AED588
Binding:
Hardback
Release:
01 Oct 2006
Language:
English
Available
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5.
Reliability of Photonics Materials and Structures: Symposium Held April 13-16, 1998, San Francisco, California, U.S.A (Materials Research Society Symposium Proceedings)
Reliability of Photonics Materials and Structures: Symposium Held April 13-16, 1998, San Francisco, California, U.S.A (Materials Research Society Symposium Proceedings)
By: Fukuda, Mitsuo, Kurkjian, Charles R., Suhir, Ephraim
Publisher: Materials Research Society
No Review Yet
AED651
Binding:
Hardcover
Release:
01-Oct-1998
Language:
English
Available
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6.
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
By: Ephraim (Portland State University, Portland, USA) Suhir
Publisher: Taylor & Francis Ltd
No Review Yet
AED642
Binding:
Paperback
Release:
04 Oct 2024
International Edition
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7.
Human-In-The-Loop
Human-In-The-Loop
By: Ephraim Suhir, Ephraim (Portland State University, Portland, USA) Suhir
Publisher: Taylor and Francis
No Review Yet
AED551
Binding:
Paperback
Release:
02 Apr 2021
Language:
English
International Edition
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Free Shipping in UAE.
8.
Moisture Sensitivity of Plastic Packages of IC Devices
Moisture Sensitivity of Plastic Packages of IC Devices
By: E. Suhir, X.J. Fan, Ephraim Suhir, X. J. Fan, X J Fan
Publisher: Springer
No Review Yet
AED2,562
Binding:
Hardback
Release:
19 Jul 2010
Language:
English
International Edition
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9.
Structural Dynamics of Electronic and Photonic Systems
Structural Dynamics of Electronic and Photonic Systems
By: Eric Connally, Ephraim Suhir, David S. Steinberg, T. X. Yu , T X Yu
Publisher: Wiley
No Review Yet
AED1,888
Binding:
Hardback
Release:
03 May 2011
Language:
English
International Edition
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10.
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
By: Y.C. Lee, C.P. Wong, Ephraim Suhir, C.P. Wong (Editor), Ephraim Suhir (Editor)
Publisher: Springer
No Review Yet
AED3,488
Binding:
Paperback
Release:
23 Aug 2016
Language:
English
Out of Stock
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11.
Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference and Exhibition Interpack 97;Advances in Electronic Packaging
Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference and Exhibition Interpack 97;Advances in Electronic Packaging
By: Au, Ephraim Suhir, M. Shiratori
Publisher: American Society Of Mechanical Engineers,u.s.
No Review Yet
AED3,309
Binding:
Hardback
Release:
15 Jun 1997
Out of Stock
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