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1.
Mechanical Behavior of Materials and Structures in Microelectronics: Volume 226
Mechanical Behavior of Materials and Structures in Microelectronics: Volume 226
By: Ephraim Suhir, Robert C Cammarata, Deborah D L Chung, Masahiro Jono
Publisher: Cambridge University Press
No Review Yet
AED308
Binding:
Hardback
Release:
01 Jan 1991
Language:
English
Available
Ships within 9-10 Days Explain..
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2.
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
By: Y.C. Lee, C.P. Wong, Ephraim Suhir, Y C Lee, C P Wong
Publisher: Springer
No Review Yet
AED588
Binding:
Hardback
Release:
01 Oct 2006
Language:
English
Available
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3.
Reliability of Photonics Materials and Structures: Symposium Held April 13-16, 1998, San Francisco, California, U.S.A (Materials Research Society Symposium Proceedings)
Reliability of Photonics Materials and Structures: Symposium Held April 13-16, 1998, San Francisco, California, U.S.A (Materials Research Society Symposium Proceedings)
By: Fukuda, Mitsuo, Kurkjian, Charles R., Suhir, Ephraim
Publisher: Materials Research Society
No Review Yet
AED656
Binding:
Hardcover
Release:
01-Oct-1998
Language:
English
Available
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4.
Structural Dynamics of Electronic and Photonic Systems
Structural Dynamics of Electronic and Photonic Systems
By: Eric Connally, Ephraim Suhir, David S. Steinberg, T. X. Yu , T X Yu
Publisher: Wiley
No Review Yet
AED1,794
Binding:
Hardback
Release:
03 May 2011
Language:
English
International Edition
Ships within 26-28 Days Explain..
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5.
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
By: Y.C. Lee, C.P. Wong, Ephraim Suhir, C.P. Wong (Editor), Ephraim Suhir (Editor)
Publisher: Springer
No Review Yet
AED3,488
Binding:
Paperback
Release:
23 Aug 2016
Language:
English
Out of Stock
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6.
Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference and Exhibition Interpack 97;Advances in Electronic Packaging
Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference and Exhibition Interpack 97;Advances in Electronic Packaging
By: Au, Ephraim Suhir, M. Shiratori
Publisher: American Society Of Mechanical Engineers,u.s.
No Review Yet
AED3,309
Binding:
Hardback
Release:
15 Jun 1997
Out of Stock
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