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Sunjung Kim

Sunjung Kim

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1.
Copper Interconnect for Silicon ULSI Seedless Copper Electrochemical Deposition for ULSI - Interconnect
Copper Interconnect for Silicon ULSI Seedless Copper Electrochemical Deposition for ULSI - Interconnect
By: Sunjung Kim
Publisher: VDM Verlag
No Review Yet
AED178
Binding:
Paperback
Release:
23 Dec 2008
Language:
English
Out of Stock
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Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
2.
Walls to Talk to
Walls to Talk to
By: Jewyo Rhii, Susanne Gaensheimer, Charles Esche, Sunjung Kim, Nick Aikens
Publisher: Walther Konig Verlag
No Review Yet
AED152
Binding:
Paperback
Release:
30 Sep 2013
Language:
English
Out of Stock
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