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Ulrich Gosele

Ulrich Gosele

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1.
Wafer Bonding
Wafer Bonding
By: Marin Alexe, Ulrich Gosele, Ulrich Gösele, Ulrich Goesele
Publisher: Springer
No Review Yet
AED3,355
Binding:
Hardback
Release:
01 Jun 2004
Language:
English
International Edition
Ships within 22-24 Days Explain..
Free Shipping in UAE.
2.
Semiconductor Wafer Bonding
Semiconductor Wafer Bonding
By: Q.Y. Tong, Ulrich Gosele, Tong, Q -Y Tong, U Gosele
Publisher: Wiley-Interscience
No Review Yet
AED1,773
Binding:
Hardback
Release:
07 Dec 1998
Language:
English
International Edition
Ships within 20-22 Days Explain..
Free Shipping in UAE.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
3.
Wafer Bonding
Wafer Bonding
By: Marin Alexe, Ulrich G. Sele, Ulrich Gosele, Ulrich Gösele, Ulrich Goesele
Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
No Review Yet
AED3,341
Binding:
Paperback
Release:
30 Sep 2011
Language:
English
International Edition
Ships within 22-24 Days Explain..
Free Shipping in UAE.
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