Advanced Spice Model for Gan Hemts (Asm-Hemt) by Sourabh Khandelwal
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Advanced Spice Model for Gan Hemts (Asm-Hemt)

Advanced Spice Model for Gan Hemts (Asm-Hemt)


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About the Book

This book discusses in detail the Advanced SPICE Model for GaN HEMTs (ASM-HEMT), a new industry standard model for GaN-based power and RF circuit design. The author describes this new, standard model in detail, covering the different components of the ASM GaN model from fundamental derivations to the implementation in circuit simulation tools. The book also includes a detailed description of parameter extraction steps and model quality tests, which are critically important for effective use of this standard model in circuit simulation and product design. Coverage includes both radio-frequency (RF), and power electronics applications of this model. Practical issues related to measurement data and parameter extraction flow are also discussed, enabling readers easily to adopt this new model for design flow and simulation tools.

  • Describes in detail a new industry standard for GaN-based power and RF circuit design;
  • Includes discussion of practical problems and their solutions in GaN device modeling;
  • Covers both radio-frequency (RF) and power electronics application of GaN technology;
  • Describes modeling of both GaN RF and power devices.


About the Author:

Sourabh Khandelwal is Senior Lecturer at the School of Engineering at Macquarie University Sydney. . He is the lead developer of ASM--HEMT compact model, which is a new industry standard compact model for GaN RF and power devices. Earlier to this role, Manager of Berkeley Device Modeling Center and Postdoctoral Researcher at the BSIM group at University of California Berkeley. Before that, he worked as Research Engineer at IBM Semiconductor Research. He has over 200 publications in top-tier conferences and journals in the area of semiconductor device modeling and circuit design..


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Product Details
  • ISBN-13: 9783030777296
  • Publisher: Springer International Publishing
  • Publisher Imprint: Springer
  • Height: 241 mm
  • No of Pages: 200
  • Spine Width: 15 mm
  • Weight: 888 gr
  • ISBN-10: 3030777294
  • Publisher Date: 10 Sep 2021
  • Binding: Hardback
  • Language: English
  • Returnable: Y
  • Sub Title: A New Industry-Standard Compact Model for Gan-Based Power and RF Circuit Design
  • Width: 168 mm


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