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Big Data Analytics for Cyber-Physical Systems

Big Data Analytics for Cyber-Physical Systems


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International Edition


About the Book

1. Cyber-Physical Systems: An Overview2. An Utility-Driven Data Transmission Optimization Strategy in Large Scale Cyber-Physical Systems3. Advanced Communications in Cyber Physical Systems4. A Framework for Speculative Job Scheduling on Mobile Cloud Resources5. Cyber-physical Autonomous Vehicular System (CAVS): A MAC Layer Perspective6. A CPS-enhanced Subway Operations Safety System Based on the Short-term Prediction of the Passenger Flow7. A CPS-Aware Crowd Evacuation Simulation8. Smart Building Sensor Drift Calibration9. Fault Tolerance-Aware Design Technique for Cyber-Physical Digital Micro10. Uncertainty Analysis and Optimization in Cyber-Physical Systems of Reservoir production11. The Optimization of Maritime Search and Rescue Simulation System Based on CPS12. A CPS-improved data estimation model for flash food early warning sensor networkIndex
About the Author:

Shiyan Hu

Professor Shiyan Hu received his Ph.D. in Computer Engineering from Texas A&M University in 2008. He is the Professor and Chair in Cyber-Physical System Security at University of Southampton. His research interests include Cyber-Physical Systems and Cyber-Physical System Security, where he has published more than 100 refereed papers, including 50+ in premier IEEE Transactions.

Prof. Hu is an ACM Distinguished Speaker, an IEEE Systems Council Distinguished Lecturer, a recipient of the 2017 IEEE Computer Society TCSC Middle Career Researcher Award, and a recipient of the 2014 U.S. National Science Foundation (NSF) CAREER Award. His publications have received a few distinctions such as the 2018 IEEE Systems Journal Best Paper Award, the 2017 Keynote Paper in IEEE Transactions on Computer-Aided Design, the Front Cover Paper in IEEE Transactions on Nanobioscience in March 2014, etc. His research has been featured in various public media such as National Science Foundation News Headlines, Science Daily, CBS, IEEE Spectrum, and Communications of ACM.

Prof. Hu is the Chair for IEEE Technical Committee on Cyber-Physical Systems. He is the Editor-In-Chief of IET Cyber-Physical Systems: Theory & Applications. He is the 2020 Editor-in-Chief Search Committee Chair for ACM Transactions on Design Automation for Electronic Systems. He is an Associate Editor for IEEE Transactions on Computer-Aided Design, IEEE Transactions on Industrial Informatics, IEEE Transactions on Circuits and Systems, ACM Transactions on Design Automation for Electronic Systems, and ACM Transactions on Cyber-Physical Systems. He is also a Guest Editor for eight IEEE/ACM journals such as Proceedings of the IEEE and IEEE Transactions on Computers. He has held chair positions in many major conferences. He is a Fellow of IET and a Fellow of British Computer Society.


Bei Yu

Bei Yu is currently an Assistant Professor at the Department of Computer Science and Engineering, The Chinese University of Hong Kong. He received the Ph.D degree from Electrical and Computer Engineering, University of Texas at Austin, USA in 2014, and the M.S. degree in Computer Science from Tsinghua University, China in 2010. His current research interests include machine learning and combinatorial algorithm with applications in VLSI computer aided design (CAD) and computer vision. He has served as TPC Chair of 1st ACM/IEEE Workshop on Machine Learning for CAD (MLCAD), served in the program committees of DAC, ICCAD, DATE, ASPDAC, ISPD, the editorial boards of Integration, the VLSI Journal, and IET Cyber-Physical Systems: Theory & Applications. He is Editor of IEEE TCCPS Newsletter.

Prof. Yu received six Best Paper Awards from International Conference on Tools with Artificial Intelligence (ICTAI) 2019, Integration, the VLSI Journal in 2018, International Symposium on Physical Design (ISPD) 2017, SPIE Advanced Lithography Conference 2016, International Conference on Computer-Aided Design (ICCAD) 2013, Asia and South Pacific Design Automation Conference (ASPDAC) 2012, four other Best Paper Award Nominations (ASPDAC 2019, DAC 2014, ASPDAC 2013, and ICCAD 2011), five ICCAD/ISPD contest awards, IBM Ph.D. Scholarship in 2012, SPIE Education Scholarship in 2013, and EDAA Outstanding Dissertation Award in 2014.


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Product Details
  • ISBN-13: 9783030434960
  • Publisher: Springer International Publishing
  • Publisher Imprint: Springer
  • Height: 234 mm
  • No of Pages: 270
  • Spine Width: 15 mm
  • Width: 156 mm
  • ISBN-10: 3030434966
  • Publisher Date: 10 Jul 2021
  • Binding: Paperback
  • Language: English
  • Returnable: Y
  • Weight: 449 gr


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