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Embedded Microprocessor System Design Using FPGAs

Embedded Microprocessor System Design Using FPGAs


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About the Book

Embedded Microprocessor Systems Basics.- FPGA Devices, Boards, and Design Tools.- Microprocessor Component Design in VHDL.- Microprocessor Component Design in Verilog.- Microprocessor Programming in C/C++.- Software Tools for Embedded Microprocessors Systems.- Design of the PicoBlaze Softcore Microprocessor.- Software tools for the PicoBlaze Softcore Microprocessor.- Altera/Intel Nios Embedded Microprocessor.- Xilinx MicroBlaze Embedded Microprocessor.- ARMv7 Cortex-A9 Embedded Microprocessor.


About the Author:

Dr. Uwe Meyer-Baese received his BSEE, MSEE, and Ph.D. "Summa cum Laude" from the Darmstadt University of Technology in 1987, 1989, and 1995, respectively. He is now a Full Professor in the ECE Department at Florida State University. He holds 3 patents, has published over 130 journal and conference papers, 9 books, and supervised more than 60 master and Ph.D. thesis projects in the real-time DSP/FPGA area. In 2003, he was awarded the "Habilitation" (venia legendi) by the Darmstadt University of Technology. He is PI and CO-PI of projects valued more than 9 million USD. His research is funded by NIH, NSF, FSU, DOD, Harris, SUN microsystems, Altera, Xilinx and the State of Florida. He is author of the best-selling textbook on DSP with FPGAs by Springer Verlag sold over 20K copies. He received in 1997 the Max-Kade Award in Neuroengineering, the Outstanding Teaching Award from Florida State University in 2008, the Best Presentation Award from SPIE in 2006, Who's Who in Science member in 2005, and the Humboldt Research Award in 2009. Dr. Meyer-Baese has been promoted by the Institute of Electrical and Electronics Engineers (IEEE) to Senior Member status in 2013.


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Product Details
  • ISBN-13: 9783030505325
  • Publisher: Springer International Publishing
  • Publisher Imprint: Springer
  • Height: 234 mm
  • No of Pages: 509
  • Spine Width: 29 mm
  • Width: 156 mm
  • ISBN-10: 3030505324
  • Publisher Date: 13 May 2021
  • Binding: Hardback
  • Language: English
  • Returnable: Y
  • Weight: 961 gr


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