Entwicklung Und Optimierung Von Prozeßkomponenten Zur Ionenunterstützten Abscheidung Bei Pvd-Verfahren
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Entwicklung Und Optimierung Von Prozeßkomponenten Zur Ionenunterstützten Abscheidung Bei Pvd-Verfahren

Entwicklung Und Optimierung Von Prozeßkomponenten Zur Ionenunterstützten Abscheidung Bei Pvd-Verfahren


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About the Book

Die physikalische Abscheidung aus der Gasphase (Physical Vapor Deposition, PVD) ist ein junges Fertigungsverfahren der Obertliichentechnik. Mit PVD-Verfahren lassen sich diinne Schichten im Bereich einiger Nanometer bis zu einigen Mikrometem aufvielen Werkstiicken erzeugen. Durch die Beschichtung lassen sich gezielt die Eigenschaften der Werkstiickober- flache veriindem. Die Oberflache dient bei allen Bauteilen als Schnittstelle zu ihrer Umwelt und wird folglich vielfliltig beansprucht. Sie mull chemischen, mechanischen oder thermischen Be- lastungen standhalten und iibernimmt oft eine zusatzliche Funktion, die dekorativ, tribologisch oder optisch wirksam ist. Diese Aufgabenfelder lassen sich in vielen Fallen mit PVD-Beschich- tungen abdecken. Der Beginn der PVD-Verfahrenstechnik war die Entwicklung des thermischen Aufdampfens. Dabei wird ein fester Stoff verdampft, der Dampf schlagt sich auf dem Beschichtungsgut (Substrat) als diinne Schicht nieder Ill. Dem Einsatzgebiet dieses einfachen Verfahrens waren jedoch schnell Grenzen gesetzt, da der Niederschlag fur viele Anwendungen unzureichende Ei- genschaften wie beispieisweise eine ungemlgende Haftung oder eine wenig kompakte Schicht- struktur aufWies. Ein groBer Fortschritt bei den PVD-Verfahren, vor aHem in der Werkzeugbe- schichtung, wurde erreicht, indem das Abscheiden plasmagestiitzt erfolgt. Auch andere Ferti- gungsverfahren verwenden ein Plasma als "Werkzeug" das Plasmaschneiden, das Plasma- schweillen, das Plasmaaktivieren und das Plasmareinigen. 1m Plasma sind angeregte und ioni- sierte Atome und Molekiile vorhanden. Dadurch werden die chemischen Reaktionen im Plas- maraum und an der Substratoberfliiche beschleunigt. Durch ein Beschleunigen der im Plasma entstehenden ionisierten Teilchen in Richtung zur Substratoberfliiche wird dort ein Teilchen- beschuB ennoglicht.


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Product Details
  • ISBN-13: 9783540585114
  • Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
  • ISBN-10: 3540585117
  • Publisher Date: 21 Oct 1994


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Entwicklung Und Optimierung Von Prozeßkomponenten Zur Ionenunterstützten Abscheidung Bei Pvd-Verfahren
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