Lead-Free Electronic Solders Book by Kv Subramanian
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Lead-Free Electronic Solders

Lead-Free Electronic Solders


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About the Book

Thermodynamics and phase diagrams of lead-free solder materials.- Phase diagrams of Pb-free solders and their related materials systems.- The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints.- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications.- Rare-earth additions to lead-free electronic solders.- Compression stress-strain and creep properties of the 52In-48Sn and 97In-3Ag low-temperature Pb-free solders.- Sn-Zn low temperature solder.- Composite lead-free electronic solders.- Processing and material issues related to lead-free soldering.- Interfacial reaction issues for lead-free electronic solders.- Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys.- Deformation behavior of tin and some tin alloys.- Mechanical fatigue of Sn-rich Pb-free solder alloys.- Life expectancies of Pb-free SAC solder interconnects in electronic hardware.- Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints under severe service environments.- Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages.- Electromigration issues in lead-free solder joints.- Stress analysis of spontaneous Sn whisker growth.- Sn-whiskers: truths and myths.- Tin pest issues in lead-free electronic solders.- Issues related to the implementation of Pb-free electronic solders in consumer electronics.- Impact of the ROHS directive on high-performance electronic systems.- Impact of the ROHS Directive on high-performance electronic systems.


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Product Details
  • ISBN-13: 9781441943026
  • Publisher: Springer
  • Publisher Imprint: Springer
  • Edition: Softcover reprint of hardcover 1st ed. 2007
  • Language: English
  • Returnable: N
  • Spine Width: 20 mm
  • Weight: 711 gr
  • ISBN-10: 1441943021
  • Publisher Date: 04 Nov 2010
  • Binding: Paperback
  • Height: 254 mm
  • No of Pages: 378
  • Series Title: English
  • Sub Title: A Special Issue of the Journal of Materials Science: Materials in Electronics
  • Width: 178 mm


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