Materials for Information Technology by Ehrenfried Zschech
Home > Technology & Engineering > Industrial chemistry & manufacturing technologies > Other manufacturing technologies > Materials for Information Technology
Materials for Information Technology

Materials for Information Technology


     0     
5
4
3
2
1



International Edition


About the Book

Recent Advances in Thin-film Deposition.- Molecular-beam Deposition of High-k Gate Dielectrics for Advanced CMOS.- LEPECVD - A Production Technique for SiGe MOSFETs and MODFETs.- Thin-film Engineering by Atomic-layer Deposition for Ultra-scaled and Novel Devices.- Atomic-layer Deposited Barrier and Seed Layers for Interconnects.- Copper CVD for Conformal Ultrathin-film Deposition.- Pushing PVD to the Limits - Recent Advances.- Surface Engineering Using Self-assembled Monolayers: Model Substrates for Atomic-layer Deposition.- Selective Airgaps: Towards a Scalable Low-k Solution.- Silicides - Recent Advances and Prospects.- TEM Characterization of Strained Silicon.- Material Aspects of Non-Volatile Memories.- An Introduction to Nonvolatile Memory Technology.- Floating-dot Memory Transistors on SOI Substrate.- Ion-beam Synthesis of Nanocrystals for Multidot Memory Structures.- Scaling of Ferroelectric-based Memory Concepts.- Device Concepts with Magnetic Tunnel Junctions.- Phase-change Memories.- Amorphous-to-fcc Transition in GeSbTe Alloys.- Organic Nonvolatile Memories.- Materials for Interconnects.- Interconnect Technology - Today, Recent Advances and a Look into the Future.- Dielectric and Scaling Effects on Electromigration for Cu Interconnects.- Texture and Stress Study of Sub-Micron Copper Interconnect Lines Using X-ray Microdiffraction.- Stress Modeling for Copper Interconnect Structures.- Conductivity Enhancement in Metallization Structures of Regular Grains.- Advanced Barriers for Copper Interconnects.- Synthesis and Characterization of Compounds Obtained by Crosslinking of Polymethylhydrosiloxane by Aromatic Rings.- Revealing the Porous Structure of Low-k Materials Through Solvent Diffusion.- Carbon Nanotube Via Technologies for Future LSI Interconnects.- Nickel Nanowires Obtained by Template Synthesis.- Materials for Assembly/Packaging.- The Importance of Polymers in Wafer-Level Packaging.- Electrically Conductive Adhesives as Solder Alternative: A Feasible Challenge.- The Role of Au/Sn Solder in Packaging.- Packaging Materials: Organic-Inorganic Hybrids for Millimetre-Wave Optoelectronics.- Wafer-Level Three-Dimensional Hyper-Integration Technology Using Dielectric Adhesive Wafer Bonding.- Advanced Materials Characterization.- Challenges to Advanced Materials Characterization for ULSI Applications.- Advanced Material Characterization by TOFSIMS in Microelectronic.- Electronic Properties of the Interface Formed by Pr2O3 Growth on Si(001), Si(111) and SiC(0001) Surfaces.- Materials Characterization by Ellipsometry.- Thermal Desorption Spectrometry as a Method of Analysis for Advanced Interconnect Materials.- Electron Backscatter Diffraction: Application to Cu Interconnects in Top-View and Cross Section.- X-ray Reflectivity Characterisation of Thin-Film and Multilayer Structures.
About the Author:

Dr Ehrenfried Zschech is manager of the Materials Analysis Department at AMD Saxony LLC & Co. KG in Dresden, Germany. Advanced Microdevices (AMD) is a global manufacturer of microprocessors and other integrated circuit-based products. AMD's manufacturing facility in Dresden is the company's most advanced and the site also hosts the company's European R&D centre.

Dr Zschech was the coordinator of the IT topic of EUROMAT 2003 in Lausanne. This book, although not a proceedings, has resulted from his work for the conference. It collects contributions on materials for information technology applications from the author's of conference papers as well as chapters from other authors in order to create a state-of-the art edited volume on the subject from the world's leading experts in academia and industry.

Dr Caroline Whelan is a researcher at the Interuniversity MicroElectronics Center (IMEC) Leuven, Belgium, a leading research institution in microelectronics funded by industry, government, ESA and the EU.

Dr Thomas Mikolajick is a researcher at Infineon Technologies AG, a German-based IC products manufacturers. Infineon's R&D activities cover innovations in nano technologies, photonics, high frequency circuits, mixed signal circuits, electronic biosensors, systems technology, emerging applications.


Best Sellers



Product Details
  • ISBN-13: 9781849969673
  • Publisher: Springer
  • Publisher Imprint: Springer
  • Edition: Softcover reprint of hardcover 1st ed. 2005
  • Language: English
  • Returnable: N
  • Spine Width: 27 mm
  • Weight: 788 gr
  • ISBN-10: 1849969671
  • Publisher Date: 22 Oct 2010
  • Binding: Paperback
  • Height: 234 mm
  • No of Pages: 508
  • Series Title: Engineering Materials and Processes
  • Sub Title: Devices, Interconnects and Packaging
  • Width: 156 mm


Similar Products

Add Photo
Add Photo

Customer Reviews

REVIEWS      0     
Click Here To Be The First to Review this Product
Materials for Information Technology
Springer -
Materials for Information Technology
Writing guidlines
We want to publish your review, so please:
  • keep your review on the product. Review's that defame author's character will be rejected.
  • Keep your review focused on the product.
  • Avoid writing about customer service. contact us instead if you have issue requiring immediate attention.
  • Refrain from mentioning competitors or the specific price you paid for the product.
  • Do not include any personally identifiable information, such as full names.

Materials for Information Technology

Required fields are marked with *

Review Title*
Review
    Add Photo Add up to 6 photos
    Would you recommend this product to a friend?
    Tag this Book Read more
    Does your review contain spoilers?
    What type of reader best describes you?
    I agree to the terms & conditions
    You may receive emails regarding this submission. Any emails will include the ability to opt-out of future communications.

    CUSTOMER RATINGS AND REVIEWS AND QUESTIONS AND ANSWERS TERMS OF USE

    These Terms of Use govern your conduct associated with the Customer Ratings and Reviews and/or Questions and Answers service offered by Bookswagon (the "CRR Service").


    By submitting any content to Bookswagon, you guarantee that:
    • You are the sole author and owner of the intellectual property rights in the content;
    • All "moral rights" that you may have in such content have been voluntarily waived by you;
    • All content that you post is accurate;
    • You are at least 13 years old;
    • Use of the content you supply does not violate these Terms of Use and will not cause injury to any person or entity.
    You further agree that you may not submit any content:
    • That is known by you to be false, inaccurate or misleading;
    • That infringes any third party's copyright, patent, trademark, trade secret or other proprietary rights or rights of publicity or privacy;
    • That violates any law, statute, ordinance or regulation (including, but not limited to, those governing, consumer protection, unfair competition, anti-discrimination or false advertising);
    • That is, or may reasonably be considered to be, defamatory, libelous, hateful, racially or religiously biased or offensive, unlawfully threatening or unlawfully harassing to any individual, partnership or corporation;
    • For which you were compensated or granted any consideration by any unapproved third party;
    • That includes any information that references other websites, addresses, email addresses, contact information or phone numbers;
    • That contains any computer viruses, worms or other potentially damaging computer programs or files.
    You agree to indemnify and hold Bookswagon (and its officers, directors, agents, subsidiaries, joint ventures, employees and third-party service providers, including but not limited to Bazaarvoice, Inc.), harmless from all claims, demands, and damages (actual and consequential) of every kind and nature, known and unknown including reasonable attorneys' fees, arising out of a breach of your representations and warranties set forth above, or your violation of any law or the rights of a third party.


    For any content that you submit, you grant Bookswagon a perpetual, irrevocable, royalty-free, transferable right and license to use, copy, modify, delete in its entirety, adapt, publish, translate, create derivative works from and/or sell, transfer, and/or distribute such content and/or incorporate such content into any form, medium or technology throughout the world without compensation to you. Additionally,  Bookswagon may transfer or share any personal information that you submit with its third-party service providers, including but not limited to Bazaarvoice, Inc. in accordance with  Privacy Policy


    All content that you submit may be used at Bookswagon's sole discretion. Bookswagon reserves the right to change, condense, withhold publication, remove or delete any content on Bookswagon's website that Bookswagon deems, in its sole discretion, to violate the content guidelines or any other provision of these Terms of Use.  Bookswagon does not guarantee that you will have any recourse through Bookswagon to edit or delete any content you have submitted. Ratings and written comments are generally posted within two to four business days. However, Bookswagon reserves the right to remove or to refuse to post any submission to the extent authorized by law. You acknowledge that you, not Bookswagon, are responsible for the contents of your submission. None of the content that you submit shall be subject to any obligation of confidence on the part of Bookswagon, its agents, subsidiaries, affiliates, partners or third party service providers (including but not limited to Bazaarvoice, Inc.)and their respective directors, officers and employees.

    Accept

    New Arrivals



    Inspired by your browsing history


    Your review has been submitted!

    You've already reviewed this product!