Novel Advances in Microsystems Technologies and Their Applications
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Novel Advances in Microsystems Technologies and Their Applications

Novel Advances in Microsystems Technologies and Their Applications

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About the Book

Microsystems technologies have found their way into an impressive variety of applications, from mobile phones, computers, and displays to smart grids, electric cars, and space shuttles. This multidisciplinary field of research extends the current capabilities of standard integrated circuits in terms of materials and designs and complements them by creating innovative components and smaller systems that require lower power consumption and display better performance. Novel Advances in Microsystems Technologies and their Applications delves into the state of the art and the applications of microsystems and microelectronics-related technologies. Featuring contributions by academic and industrial researchers from around the world, this book: Examines organic and flexible electronics, from polymer solar cell to flexible interconnects for the co-integration of micro-electromechanical systems (MEMS) with complementary metal oxide semiconductors (CMOS) Discusses imaging and display technologies, including MEMS technology in reflective displays, the fabrication of thin-film transistors on glass substrates, and new techniques to display and quickly transmit high-quality images Explores sensor technologies for sensing electrical currents and temperature, monitoring structural health and critical industrial processes, and more Covers biomedical microsystems, including biosensors, point-of-care devices, neural stimulation and recording, and ultra-low-power biomedical systems Written for researchers, engineers, and graduate students in electrical and biomedical engineering, this book reviews groundbreaking technology, trends, and applications in microelectronics. Its coverage of the latest research serves as a source of inspiration for anyone interested in further developing microsystems technologies and creating new applications.

Table of Contents:
Part I Organic and Flexible Electronics: Device Modelling for SPICE Simulations in Organic Technologies. Nanoscale Phase Separation and Device Engineering in Polymer Solar Cells. Mechanically Flexible Interconnects and TSVs: Applications in CMOS/MEMS Integration. A Wafer-Scale Rapid Electronic Systems Prototyping Platform: User Support Tools and Thermo-Mechanical Validation. Part II Imaging and Display Technologies: mirasol Displays: MEMS-Based Reflective Display Systems. Thin-Film Transistors Fabricated on Intentionally Agglomerated, Laser-Crystallized Silicon on Insulator. New Approaches for High-Speed, High-Resolution Imaging. Terahertz Communications for Terabit Wireless Imaging. Increasing Projector Contrast and Brightness through Light Redirection. Part III Sensors and Microdevices: Theoretical Electromagnetic Survey: Application to a CMOS-MEMS Planar Electrodynamic Microphone. Thin-Film Sensors. Technologies for Electric Current Sensors. Power Density Limits and Benchmarking of Resonant Piezoelectric Vibration Energy Harvesters. Microwave Sensors for Non-Invasive Monitoring of Industrial Processes. Microwave Reflectometry for Sensing Applications in the Agrofood Industry. Part IV Point-of-Care and Biosensors: Applications of Sensor Systems in Prognostics and Health Management. Rigid Body Motion Capturing by Means of Wearable Inertial and Magnetic MEMS Sensor Assembly: Towards the Reconstitution of the Posture of Free-Ranging Animals in Bio-Logging. Point-of-Care Testing Platform with Nanogap-Embedded Field-Effect Transistors. Bionanotechnological Advances in Neural Recording and Stimulation. Part V Ultra-Low-Power Biomedical Systems: Advances in Ultra-Low-Power Miniaturized Applications for Health Care and Sports: The Sensium™ Platform. Ultra-Low-Power Harvesting Body-Centred Electronics for Future Health Monitoring Devices. ADC Basics and Design Techniques for a Low-Power ADC for Biomedical Applications. Ultra-Low-Power Techniques in Small Autonomous Implants and Sensor Nodes. Index.


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Product Details
  • ISBN-13: 9781138072794
  • Publisher: Taylor & Francis Ltd
  • Publisher Imprint: CRC Press
  • Height: 234 mm
  • No of Pages: 650
  • Width: 156 mm
  • ISBN-10: 1138072796
  • Publisher Date: 29 Mar 2017
  • Binding: Paperback
  • Language: English
  • Weight: 947 gr


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