Proceedings of the 5th International Conference on Signal Processing and Information Communications
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Proceedings of the 5th International Conference on Signal Processing and Information Communications

Proceedings of the 5th International Conference on Signal Processing and Information Communications


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International Edition


About the Book

This book presents the proceedings of the 5th International Conference on Signal Processing and Information Communications (ICSPIC)), which was held in Paris, France on March 14-16, 2022. The conference solicits papers on all aspects of signal processing and information communications, which includes mixed signal processing, multimedia signal processing, nonlinear signal processing, communication theory and techniques, optical communications, and wireless networks. The conference is made up of theorists and experts in advanced characterization techniques in the fields of signal processing and information communications, which brings researchers, practitioners, and scientists in discussion of the latest methods, research developments, and future opportunities.


About the Author: Dr. Chua-Chin Wang received the Ph.D. degree in electrical engineering from SUNY (State University of New York) at Stony Brook, USA, in 1992. He then joined Department of Electrical Engineering, National Sun Yat-Sen University (NSYSU), Taiwan. He was Chairman of this department during 2009 - 2012. He was CEO of Operation Center of Industry-University Cooperation, NSYSU, in 2012-2014. He was appointed to be VP of Office of Industrial Collaboration and Continuing Education Affairs, from 2014 to 2015. He was elected as Dean of Engineering College during 2014-2017. He became as Director Generalof Underwater Vehicle R&D Center since 2018. He is now Vice President, Office of Research and Development, NSYSU. Dr. Wang's research interests include memory and logic circuit design, communication circuit design, bio-medical circuits, and particularly interfacing I/O circuits. He also won Distinguished Electrical Engineering Professor Award of Chinese Institute of Electrical Engineers in 2007. In 2010, he was honored to be Distinguished Professor of National Sun Yat-Sen University. In 2012, he won "Distinguished Engineering Professor" Award of Chinese Institute of Engineers and Outstanding Research Award of NSYSU. He became IET Fellow in 2012. He was named as ASE Chair Professor in 2013 for the recognition of his achievement in the area of VLSI design and contribution to industry technology development. He won Outstanding Technical Achievement Award of IEEE Tainan Section in 2018. Prof. Wang has devoted himself for many IEEE services. He was Tainan Chapter Chair of IEEE Circuits and Systems Society (CASS) in 2007-2008. He was also the founding Tainan Chair of IEEE Solid-State Circuits Society (SSCS) for 2007-2008, and the founding Consultant of IEEE NSYSU Student Branch. He was elected to be Vice Chair of IEEE Tainan Section in 2012. He was elected to be Chair of IEEE CASS Nanoelectronics and Giga-scale Systems (NG) Technical Committee to serve during 2008-2009. He has been invited to be Associate Editors of IEEE Trans. on TCAS-I (2010-2013) and TCAS-II (2010-2011). He was General Chair of 2012 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), which is the flagship conference of IEEE CASS Region 10.

Dr. Arumugam Nallanathan is Professor of Wireless Communications and the Founding Head of Communication Systems Research (CSR) Group in the School of Electronic Engineering and Computer Science at Queen Mary University of London (QMUL) from September 2017. He was with the Department of Informatics at King's College London from December 2007 to August 2017, where he was Professor of Wireless Communications from April 2013 to August 2017. He was an Assistant Professor in the Department of Electrical and Computer Engineering, National University of Singapore from August 2000 to December 2007.


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Product Details
  • ISBN-13: 9783031131806
  • Publisher: Springer International Publishing
  • Publisher Imprint: Springer
  • Height: 234 mm
  • No of Pages: 186
  • Spine Width: 13 mm
  • Width: 156 mm
  • ISBN-10: 3031131800
  • Publisher Date: 17 Nov 2022
  • Binding: Hardback
  • Language: English
  • Returnable: Y
  • Weight: 503 gr


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