Recent Progress in Lead-Free Solder Technology by Mohd Arif Anuar Mohd Salleh
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Recent Progress in Lead-Free Solder Technology

Recent Progress in Lead-Free Solder Technology


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About the Book

Recent Studies in The Development of Ceramic Reinforced Lead-Free Composite Solder.- Development of Geopolymer Ceramic Reinforced Solder.- Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders.- Molecular Dynamic on the Nanoparticle Reinforcement into Lead-free Solder during Reflow Soldering Process.- Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics.- Advanced assembly of Miniaturized Surface Mount Technology Components using Nano-Reinforced Solder Paste.- Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bi.- The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation & Experimental.- Flux Modification for Wettability and Reliability Improvement in Solder Joints.- Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints.- Significance of Interfacial Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint and Methods of IMC Layer Thickness Measurements.- The Effect of Laser Soldering onto Intermetallic Compound Formation and Growth.- Reliability Analysis on the Flexible Printed Circuit Board During Reflow Soldering.- Solder Paste's Rheology Data for Stencil Printing Numerical Investigations.- Tin Whiskers Growth in Electronic Assemblies


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Product Details
  • ISBN-13: 9783030934408
  • Publisher: Springer Nature Switzerland AG
  • Binding: Hardback
  • Language: English
  • Returnable: N
  • Sub Title: Materials Development, Processing and Performances
  • Width: 156 mm
  • ISBN-10: 3030934403
  • Publisher Date: 02 Mar 2022
  • Height: 234 mm
  • No of Pages: 342
  • Spine Width: 21 mm
  • Weight: 702 gr


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Recent Progress in Lead-Free Solder Technology
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