Silicon Analog Components Book by Badih El-Kareh
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Silicon Analog Components

Silicon Analog Components


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About the Book

The World Is Analog.- Review of Single-Crystal Silicon Properties.- PN Junctions.- Rectifying and Ohmic Contacts.- Bipolar and Junction Field-Effect Transistors.- High-Voltage and Power Transistors.- Passive Components.- Process Integration.- Mismatch and Noise.- Chip Reliability.
About the Author:

Dr. Badih El-Kareh is an independent consultant, retired IBM and Texas Instruments physicist. He has over 40 years' experience in semiconductor device design, process integration, and characterization. This includes the development of advanced CMOS and BiCMOS processes and devices for analog, memory, digital, and high-voltage applications. He has 30 years' experience in academic and industrial teaching and is author of a book on VLSI Silicon Devices, a book on Modern Semiconductor Processing Technologies, and a book on Silicon Devices and Process Integration. He authored and co-authored 35 papers and has 52 US patents issued. Dr. El-Kareh is a senior member of the IEEE.

Lou Hutter has almost 35 years of experience in the semiconductor industry. As Director of the Mixed-Signal Technology Development group at TI, he was responsible for all analog, mixed-signal, RF, and power technology development in the company, supporting every major business unit. After retiring from TI in 2007, he became the General Manager of the Analog Foundry business unit at Dongbu HiTek, a S. Korean foundry, where he was a Senior VP. He was elected a TI Fellow in 1995, holds 47 U.S. patents, and has co-authored over 30 papers. His focus areas have been in high-performance analog CMOS, high-power BCD technology, power metallization, SiGe BiCMOS, technology road-mapping, and technology development methodology.



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Product Details
  • ISBN-13: 9783030150846
  • Publisher: Springer
  • Publisher Imprint: Springer
  • Height: 234 mm
  • No of Pages: 648
  • Spine Width: 38 mm
  • Weight: 1201 gr
  • ISBN-10: 3030150844
  • Publisher Date: 16 Aug 2019
  • Binding: Hardback
  • Language: English
  • Returnable: Y
  • Sub Title: Device Design, Process Integration, Characterization, and Reliability
  • Width: 156 mm


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