Thermal Conductivity 20 by D. P. H. Hasselman- Bookswagon UAE
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Thermal Conductivity 20

Thermal Conductivity 20


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International Edition


About the Book

The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks and grew out of the needs of researchers in the field. The Conferences were held annually from 1961 to 1973 and have been held biennially since 1975 when our Center for Informa- tion and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences. -These Conferences provide a broadly based forum for researchers actively working on the thermal con- ductivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible. arti- ficial barriers between disciplines and gather together in increasing num- bers without the need of national publicity and continuing funding support. when they see something worthwhile going on. It is believed that this ser- ies of Conferences not only will grow stronger. but will set an example for researchers in other fields on how to jointly attack their own problem areas.


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Product Details
  • ISBN-13: 9781461280699
  • Publisher: Springer
  • Publisher Imprint: Springer
  • Edition: Softcover reprint of the original 1st ed. 1989
  • Language: English
  • Returnable: N
  • Spine Width: 23 mm
  • Width: 170 mm
  • ISBN-10: 1461280699
  • Publisher Date: 26 Sep 2011
  • Binding: Paperback
  • Height: 244 mm
  • No of Pages: 440
  • Series Title: English
  • Weight: 770 gr


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